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“WATER-COOLING SYSTEM FOR AMPLIFIER”

ERWAN ZAMMI BIN ELIAS (2000411976)

NOOR AZMAN BIN AHMAD (2000411720)

FACULTY OF ELECTRICAL ENGINEERINq l INIVERSITI TEKNOLOGI MARA

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TABLE OF CONTENT PAGE

Acknowledgement i

Abstract i i

CHAPTER

1.

INTRODUCTION

1.1 Introduction 1

1.2 Scope of work 2

1.3 Objective of the project 2

2. THE CIRCl IIT DESIGN AND OPERATION

2.1 Circuit design

.3

2.1.1 Schematic diagram 3

2.1.2 Component list and data 5

3 CIRCUIT DISCRETION

3.1 Circuit diagram 13

3.2 Amplifier 13

3.3 Tone control 13

3.4 Audio-level LED Display 14

4 HARDWARE CONSTRUCTION

4.1 I Iardware construction procedure 15

4.1.2 Etching 15

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ACKNOWLEDGEMENT

We were thankful to Allah because blessing us from early till the end while we were doing this project.

1 would thank my supervisor, Miss Noor Azila Bt. Hj. Ismail for her kindness, support and concern about our project- 'Water-cooling System for Amplifier’.

I would also like to express my thanks to our parent for their time and effort in completing and successions this project.

To our friends that not acceptable in our appreciation, thanks for your advices and cooperation.

Lastly, thanks to all of member that support to make this project successful.

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ABSTRACT

Integrated Circuit (IC) is a component that is combination of gates. IC is very sensitive to heat.

When high temperature is apply to IC, the effieiency of the IC will be getting low and at last the IC will be damage. That’s why in many conditions, IC have to be install with heat sink. But heat sink is not enough to release all heat from the 1C. It’s because heat sink just decrease a little bit and maintain the heat at the certain temperature. So, the 1C still have heat at the pertain

temperature.

After make a research, we built up one projeet to settle this problem - “Water-Cooling System for Amplifier”. We use amplifier only for the application of our cooler system. It is because amplifier is the easiest example. If we flow water through the heat sink at IC, the result we get is the whole heat from the IC will released. It's because water is a very good conductor for hpat. The water will absorb all heat and take it away. So, when this process is repeated again and again, the IC will always in cool. As a safety, below the heat sink there is a water deteetor cirpuit in case of leakage. If leakage happens, this circuit will shut down the centrifugal pump an^ “bipping” the buzzer, flien a 12v fan will lurn on automatically to substitute the water-cooling system.

iii

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CHAPTER 1 INTRODUCTION

1.1. INTRODUCTION

The main reason of making this project is to decrease the temperature of any kind of electronic circuit tha' used Integrated Circuit (IC). As usually when an IC operated in any electronic circuit, it will reach maximum heat temperature. Even if heat temperature of 1C cooled down by ‘heat sink’ but tl ere no totally heat sink out.

As our project completed, there is no more problem occur when water has been supplied through ‘heat sink’. Then water will flow out by small plastic tube. This process will continuously till the circuit is shut off. For protection of our circuit, we hgve provided water detector circuit that will cut off the voltage supply to water pump motor. Automatically water will stop flow and for enhanced this circuit will be support by a small 12V fan. In our explanation for further details about the processes happen in this circuit we will divide into five chapters.

Our first explanation is about components that we use in this project. This will give tire detailed about list of component, specification, characteristic and how it will operates in this circuit.

Next, we also explain about the circuit description. This will discuss about how the circuit operates when voltage been supplied. Further more, there are some calculations about the circuit operation. In this chapter, wc also include circuit diagram that will sljow detailed about this circuit.

In third chapter, there is more explanation about hardware processes. There are many step of making this project function as desired. At first, we will explain about process making Printed Circuit Board (PCB). Then about soldering the component and plug in the circuit in a hand made casing.

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